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Design, layout, and simulation files of the paper "Hexagons are the Bestagons: Design Automation for Silicon Dangling Bond Logic" by M. Walter, S. S. H. Ng, K. Walus, and R. Wille in DAC 2022.
Design, layout, and simulation files of the paper "Atomic Defect-Aware Physical Design of Silicon Dangling Bond Logic on the H-Si(100)-2×1 Surface" by M. Walter, J. Croshaw, S. S. H. Ng, K. Walus, R. Wolkow, and R. Wille in DATE 2024.